| 摘要 |
The present invention relates to an apparatus for cutting a wafer, wherein the wafer cutting process is performed along a back side of a wafer, a semiconductor chip being formed on the front side thereof, by cutting the wafer along the back side of the wafer by directly recognizing the semiconductor chip shape formed on the front side of the wafer thereby minimizing cutting defects due to sawing blade misalignment. The present invention includes a hole formed in the center portion of a chuck table on which the wafer, which is facing down, is attached and a camera installed under the hole of the chuck table. After the wafer is properly aligned by the camera recognizing the semiconductor chip shape formed on the front side of the wafer, a wafer cutting process is performed by a sawing blade.
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