| 摘要 |
An optical device is formed by a first chip and a second chip bonded together. The first chip (4 has an optical layer of glass housing an optical circuit; the second chip has a body of semiconductor material housing integrated electronic components and coated with a bonding layer of glass fixed directly and contiguous to the optical layer of the first chip. The bonding layer delimits cavities facing corresponding cavities in the first chip in positions corresponding to the intersection points of waveguides constituting the optical circuit. The cavities are filled with a liquid having the same refractive index as the waveguides. Underneath each cavity, in the body of semiconductor material there is present a resistor, which, when traversed by current, causes formation of a bubble inside the chamber and deflection of the light beam traversing a waveguide towards a different waveguide.
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