OPTICAL SEMICONDUCTOR MODULE AND METHOD OF PRODUCING THE SAME

摘要

An optical semiconductor module wherein the proportion of the junction area between an electronic cooling element and bottom plate with respect to the bottom plate area of a package is increased,thus increasing the rate of absorption of heat by the electronic cooling element even if the bottom plate area of the package is the same.A package(11)has a plurality of divisional electronic cooling elements(16)mounted thereon.The divisional electronic cooling elements(16)are inserted between the inner projecting portions(14a)of ceramic terminals(14)projecting into the inside of the package(11)and a bottom plate(13)and are joined to the latter,the electronic cooling elements(16)being connected in series by copper chips(20).The sum of the junction areas between the plurality of divisional electric cooling elements(16)and the bottom plate(13)is not less than 75% of the area of the bottom plate(13)in the package(11).