发明名称 |
Retaining ring with active edge-profile control by piezoelectric actuator/sensors |
摘要 |
A polishing head for holding a wafer during a polishing process without the edge-effect or the edge peeling defect and a method for improving edge profile on a wafer during a polishing process are described. The polishing head is constructed by a carrier head, a retaining ring, and at least three piezoelectric actuator/sensors mounted in-between a recessed peripheral edge portion of the carrier head and a top surface of the retaining ring.
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申请公布号 |
US2003027498(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20010920876 |
申请日期 |
2001.08.02 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
TSENG TUNG-CHING;LIU SHENG YUNG |
分类号 |
B24B37/04;B24B41/06;B24B49/10;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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