发明名称 |
Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array |
摘要 |
In a method for fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electro- or electroless-plating, or electrodeposition. At least a surface of the first plated or electrodeposited layer is made electrically conductive. After that, the insulating mask layer is removed, and a second plated layer is formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroplating to firmly fix the first plated or electrodeposited layer to the substrate.
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申请公布号 |
US2003024820(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20020263745 |
申请日期 |
2002.10.04 |
申请人 |
TESHIMA TAKAYUKI;YAGI TAKAYUKI |
发明人 |
TESHIMA TAKAYUKI;YAGI TAKAYUKI |
分类号 |
B29C33/38;B29L11/00;G02B3/00;(IPC1-7):C25D5/02 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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