发明名称 Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array
摘要 In a method for fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electro- or electroless-plating, or electrodeposition. At least a surface of the first plated or electrodeposited layer is made electrically conductive. After that, the insulating mask layer is removed, and a second plated layer is formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroplating to firmly fix the first plated or electrodeposited layer to the substrate.
申请公布号 US2003024820(A1) 申请公布日期 2003.02.06
申请号 US20020263745 申请日期 2002.10.04
申请人 TESHIMA TAKAYUKI;YAGI TAKAYUKI 发明人 TESHIMA TAKAYUKI;YAGI TAKAYUKI
分类号 B29C33/38;B29L11/00;G02B3/00;(IPC1-7):C25D5/02 主分类号 B29C33/38
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