Method for producing six double-sided single printed circuit boards during the manufacturing of blanks applies front/rear-side patterns for a conductor circuit/component layout and a printed circuit board to a carrier device.

摘要

Front-side patterns (13) for a conductor circuit/component layout and rear-side patterns (14) for a printed circuit board (21) are applied to a carrier device (20) for assembling six single printed circuit boards during a production process. Top and bottom sides of the carrier device have an identical design regarding the layout, fitting and alignment of the patterns and match each other when seen from above.