发明名称 Radio frequency circuit manufacturing method and radio frequency circuit
摘要 Disclosed is a radio frequency circuit having a membrane structure and manufacturing method for the same. The radio frequency circuit has a circuit element formed on an insulating material plate having copper bonded on both surfaces or one surface thereof whereby a metal substrate having a hollow bore and the insulating material plate forming the circuit element are bonded together. The circuit element is mounted with an active element on which a lid having a partition wall is bonded for packaging. The hollow bore in the metal substrate, for forming a membrane structure, is formed by press-blanking. Because the metal substrate is not wet-etched, dimensions control can be easily, precisely made on a hollow bore region of the metal substrate. Furthermore, it is possible to shorten the working time on the hollow bore region.
申请公布号 US2003024633(A1) 申请公布日期 2003.02.06
申请号 US20020187735 申请日期 2002.07.02
申请人 OGURA HIROSHI;TAKAHASHI KAZUAKI 发明人 OGURA HIROSHI;TAKAHASHI KAZUAKI
分类号 H01L23/12;H01L23/02;H01P3/02;H01P5/107;H01P11/00;H05K1/02;H05K1/05;H05K1/18;H05K3/00;H05K3/44;(IPC1-7):B32B31/00;H01L21/44 主分类号 H01L23/12
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