发明名称 |
Radio frequency circuit manufacturing method and radio frequency circuit |
摘要 |
Disclosed is a radio frequency circuit having a membrane structure and manufacturing method for the same. The radio frequency circuit has a circuit element formed on an insulating material plate having copper bonded on both surfaces or one surface thereof whereby a metal substrate having a hollow bore and the insulating material plate forming the circuit element are bonded together. The circuit element is mounted with an active element on which a lid having a partition wall is bonded for packaging. The hollow bore in the metal substrate, for forming a membrane structure, is formed by press-blanking. Because the metal substrate is not wet-etched, dimensions control can be easily, precisely made on a hollow bore region of the metal substrate. Furthermore, it is possible to shorten the working time on the hollow bore region.
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申请公布号 |
US2003024633(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20020187735 |
申请日期 |
2002.07.02 |
申请人 |
OGURA HIROSHI;TAKAHASHI KAZUAKI |
发明人 |
OGURA HIROSHI;TAKAHASHI KAZUAKI |
分类号 |
H01L23/12;H01L23/02;H01P3/02;H01P5/107;H01P11/00;H05K1/02;H05K1/05;H05K1/18;H05K3/00;H05K3/44;(IPC1-7):B32B31/00;H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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