Protective device for subassemblies

摘要

A protective device is described for subassemblies having a substrate and components disposed thereon and to be protected, for example semiconductor components. The protective device has at least one covering element for covering a subassembly, and at least one compression prevention element, which is disposed between the at least one covering element and the substrate and which is connected to the substrate and a surface of the covering element which faces the components and the substrate in such a way that a predefined spacing between covering element and the components to be protected can be maintained or is maintained.