Process for sequentially manufacturing copper cladded HDI multilayer laminates used in circuit manufacture, involves coating HDI-ML core laminates in double roller coating devices with dielectric materials

摘要

Process for sequentially manufacturing copper cladded HDI multilayer laminates involves heating HDI-ML core laminates, coating in a first double roller coating device with a 70-100% dielectric A, coating the HDI-ML core laminates in a second double roller coating device with a 50-100% dielectric B and laminating both sides with a coated copper foil. Process for sequentially manufacturing copper cladded HDI multilayer laminates comprises: heating HDI-ML core laminates to 40-140 deg C; coating in a first double roller coating device (4) with a 70-100% dielectric A (5) using a smooth roller (6) to fill the holes and quenching; using a lower chromed steel roller (10) to ventilate the holes and for cooling; hardening using UV radiators; coating the HDI-ML core laminates in a second double roller coating device (12) with a 50-100% dielectric B (18); heating the upper dielectric layer with infrared (IR) radiators (21) in a drier (20); leveling to a ripple of less than 10 mu m and subjecting the lower side to IR radiation; laminating both sides with a coated copper foil using cooled roller laminators; gelling in a first press; hardening in a second press; and cooling in a third press. An Independent claim is also included for a device for carrying out the process. Preferred Features: The bores are filled with dielectric A before coating the HDI-ML laminates with dielectric B.