发明名称 |
Injection mold for semi-solidified Fe alloy |
摘要 |
An injection mold for semi-solidified Fe alloy includes a scalping gate for eliminating surface oxide film of a semi-solidified Fe alloy injected into the mold cavity from a pressure chamber. The scalping gate is arranged between the pressure clamber and a runner that is in communication with the mold cavity. The mold halves and the scalping gate are each formed of a copper alloy having a thermal conductivity of not less than 120 W/(m.K) and a hardness of not less than 180 HB. The mold halves and the scalping gate each has a cermet layer consisting essentially of at least one member selected from a group consisting of Co, Cu, Cr and Ni. The cermet layer is formed by electro-spark deposition, via an intermediate layer of Ni alloy also formed by electro-spark deposition.
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申请公布号 |
US2003024682(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20020158580 |
申请日期 |
2002.05.30 |
申请人 |
HONDA GIKEN KOGYO KABUSHIKI KAISHA |
发明人 |
TSUCHIYA MASAYUKI;UENO HIROAKI;TAKAGI ISAMU;MURAMATSU NAOKUNI;YASUDA MASATO |
分类号 |
B23H9/00;B22C9/06;B22D17/00;B22D17/20;B22D17/22;C22C9/06;C22C29/06;C22C29/08;C22C29/14;C23C28/00;(IPC1-7):B22D17/10;B22D17/12 |
主分类号 |
B23H9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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