A semiconductor device for forming a coil with a high inductance and a high Q value on a semiconductor substrate. A semiconductor device (10) comprises a rectangular semiconductor substrate (12), pads formed near four corners of this semiconductor substrate (12), pads (30) formed in the peripheral region along each side other than the corners, and a bonding wire (40) for connecting adjacent pads (20). The circulation of the bonding wire (40) along the periphery of the semiconductor substrate (12) with the pads (20) formed in the corners constitutes a coil.
