发明名称 METHOD AND APPARATUS FOR CONTROLLING A MOLD MELT-FLOW PROCESS USING TEMPERATURE SENSORS
摘要 A method and apparatus controlling a mold melt flow using inner (impinge) and/or edge temperature sensors (316, 310, 312, 314). Thermal waveforms from thermal sensor array data such that if a sequence of melt temperature set-point trigger times fluctuates outside control limits, then the melt-flow is judged as a hotter/faster or cooler/slower melt-flow injection process. An initial melt temperature set-point "trigger" and second reference set-point "trigger" are combined to control the closure of at least one cavity gate in accordance with an injection melt-flow time and temperature profile. The nozzle orifice (310) area sets an initial melt-flow rate. Each mold cavity (318) final melt-flow "pack" volume is preferably contolled by a gate cavity melt shut-off system that is responsive to the sensed temperature(s), resulting in each cavity melt-flow injection process volume being held substantially constant, for a uniform resin "shrink" density.
申请公布号 WO0236326(A9) 申请公布日期 2003.02.06
申请号 WO2001US46619 申请日期 2001.11.05
申请人 BUJA, FREDERICK, J. 发明人 BUJA, FREDERICK, J.
分类号 B29C45/76;B29C45/78;(IPC1-7):B29C45/77 主分类号 B29C45/76
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