发明名称 Semiconductor device and fabrication method thereof
摘要 A semiconductor device and fabrication method thereof restrains an amplified current between input voltage Vin and ground voltage Vss, and first and second n-wells are biased into internal voltage sources, whereby the current-voltage characteristic of the input pad becomes stabilized during an open/short checkup of a semiconductor device. The semiconductor device includes a semiconductor substrate having a plurality of device isolation regions, first and second n-wells horizontally spaced from either of the plurality of device isolation regions, a p-channel transistor formed in the second n-well, an input protection transistor horizontally spaced from the first n-well and the device isolation region, on a symmetrical portion by the first n-well to the second n-well, and a guard ring formed between the first n-well and the input protection transistor.
申请公布号 US2003025164(A1) 申请公布日期 2003.02.06
申请号 US20020252410 申请日期 2002.09.24
申请人 发明人 LEE CHANG SOO
分类号 H01L21/76;H01L21/761;H01L21/762;H01L21/822;H01L21/8242;H01L27/02;H01L27/04;H01L27/08;H01L27/092;H01L27/108;H01L29/06;H01L29/40;(IPC1-7):H01L29/00;H01L31/119;H01L31/113;H01L31/062;H01L29/94;H01L29/76 主分类号 H01L21/76
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