发明名称 Memory heat sink device
摘要 A memory heat sink device includes a heat sink piece and a clamp member, wherein a retaining portion is disposed at the upper end rim of the heat sink to assemble two heat sink pieces and to make a space on the inner side for receiving a memory; a position limiting slot is disposed on the outer lateral plane with a retainer hole at the upper end thereof for hooking a reverse hook of the clamp member; a guide hole is disposed at the upper end of the retaining hole; the upper end rim connects with the guide hole bends to form a bearing retainer seat; the clamp member placed across the bearing retainer seat clamps two heat sink pieces to press the opening end into the position limiting slot, thereby the reverse hook and the retainer hole are fixedly hooked to easily assemble a heat sink device.
申请公布号 US2003026076(A1) 申请公布日期 2003.02.06
申请号 US20010023931 申请日期 2001.12.21
申请人 WEI WEN-CHEN 发明人 WEI WEN-CHEN
分类号 H01L23/36;H01L23/40;H05K7/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/36
代理机构 代理人
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