| 摘要 |
A negative photoresist for transferring a photomask to a semiconductor wafer includes a passivated component that is activated by an exposure radiation, the activated component being configured to interact with the uppermost layer of the semiconductor wafer at the interface, the interaction ensuring increased adhesion between the negative photoresist and the substrate. Alternatively, a positive photoresist for transferring a photomask to a semiconductor wafer includes a component that is passivated by an exposure radiation, the activated component being configured to interact with the uppermost layer of the semiconductor wafer at the interface, the interaction ensuring increased adhesion between the positive photoresist and the substrate.
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