PACKAGED OPTICAL MICRO-MECHANICAL DEVICE

摘要

A packaged optical micro-mechanical device. A die 24 includes one or more optical micro-mechanical devices 43 on a first surface of a substrate. The first surface includes a die reference surface 42. A package frame 20 includes an aperture 22 and a package frame reference surface 28 proximate the aperture adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more V-grooves 50 are positioned relative to an optical interface reference plane 44 adjacent to the micro-mechanical devices and terminating adjacent to the aperture. One or more optical fibers are located in the V-grooves optically coupled with one or more of the optical micro-mechanical devices.