发明名称 Patterning three dimensional structures
摘要 A three dimensional circuit structure including tapered pillars between first and second signal lines. An apparatus including a first plurality of spaced apart coplanar conductors disposed in a first plane over a substrate; a second plurality of spaced apart coplanar conductors disposed in a second plane, the second plane parallel to and different from the first plane; and a plurality of cells disposed between one of the first conductors and one of the second conductors, wherein each of the plurality of cells have a re-entrant profile.
申请公布号 US2003025210(A1) 申请公布日期 2003.02.06
申请号 US20020255884 申请日期 2002.09.26
申请人 LI CALVIN K.;KNALL N. JOHAN;VYVODA MICHAEL A.;CLEEVES JAMES M.;SUBRAMANIAN VIVEK 发明人 LI CALVIN K.;KNALL N. JOHAN;VYVODA MICHAEL A.;CLEEVES JAMES M.;SUBRAMANIAN VIVEK
分类号 H01L21/265;H01L21/3213;H01L21/4763;H01L21/77;H01L21/822;H01L21/84;H01L23/48;H01L23/52;H01L27/06;H01L27/12;H01L29/00;H01L29/40;(IPC1-7):H01L29/40 主分类号 H01L21/265
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