发明名称 |
Patterning three dimensional structures |
摘要 |
A three dimensional circuit structure including tapered pillars between first and second signal lines. An apparatus including a first plurality of spaced apart coplanar conductors disposed in a first plane over a substrate; a second plurality of spaced apart coplanar conductors disposed in a second plane, the second plane parallel to and different from the first plane; and a plurality of cells disposed between one of the first conductors and one of the second conductors, wherein each of the plurality of cells have a re-entrant profile.
|
申请公布号 |
US2003025210(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20020255884 |
申请日期 |
2002.09.26 |
申请人 |
LI CALVIN K.;KNALL N. JOHAN;VYVODA MICHAEL A.;CLEEVES JAMES M.;SUBRAMANIAN VIVEK |
发明人 |
LI CALVIN K.;KNALL N. JOHAN;VYVODA MICHAEL A.;CLEEVES JAMES M.;SUBRAMANIAN VIVEK |
分类号 |
H01L21/265;H01L21/3213;H01L21/4763;H01L21/77;H01L21/822;H01L21/84;H01L23/48;H01L23/52;H01L27/06;H01L27/12;H01L29/00;H01L29/40;(IPC1-7):H01L29/40 |
主分类号 |
H01L21/265 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|