| 摘要 |
<p>A baffling plate (7) having an opening is interposed between a semiconductor substrate (a to-be-plated substrate) (4) and an anode (5). The periphery of the opening is shorter than the edge of the semiconductor substrate (4) by a predetermined length, which is so set that the difference of the dimensions of the semiconductor substrate (4) and the opening is most suitable for uniforming the plating thickness (bump electrode) over the surface of the semiconductor substrate (4). Thus, a plating method and a plating apparatus are provided which enable the thickness of the plating to be almost free of variation by disposing a baffling plate of simple shape without inviting an increase of the manufacturing cost of the plating apparatus.</p> |
