| 摘要 |
In an integrated circuit structure, the improvement comprising a self-passivating Cu-laser fuse with good resistance to oxidation and corrosion and improved adhesion in the interface between the fuse and metallization lines and a dielectric cap subsequent to blowing the fuse by an energizing laser, the fuse comprising: a metallization-line (13); a liner (12) separating the metallization line and a combination Cu-alloy seed layer (11) and a pure Cu layer (10) ; a dielectric (14) surrounding the liner; and a dielectric cap (15) disposed over the surrounding dielectric, the liner and the combination Cu-alloy seed layer and pure Cu layer; the laser fuse being characterized after laser energizing by dopant-rich self-passivation areas: a) on the open Cu-fuse surface; and b) in the interfaces between: (i) the Cu-alloy seed layer and the liners and dielectric; and (ii) between the pure Cu layer and the dielectric cap. |
