发明名称 POLISHING DEVICE SUPPLIED WITH SLURRY HAVING OZONE WATER
摘要 PURPOSE: A polishing device supplied with slurry having ozone water is provided to quickly perform the polishing process by supplying the slurry including the ozone water to the polishing device and using the slurry as an abrasive. CONSTITUTION: An ozonizer(20) generates ozone by using oxygen supplied from an oxygen supply unit(18). An ozone water generating unit(22) dissolves the ozone in ultra-pure water supplied from a first ultra-pure water supply unit(32), and generates ozone water. An ozone water tank(24) stores the ozone water. A slurry mixing unit(26) uses the ozone water, slurry without an oxidizer, and the ultra-pure water, and mixes the slurry with the ozone. A second slurry supply unit(28) supplies the slurry to a polishing device(30). A control unit(10) controls the oxygen supply unit, the first ultra-pure water supply unit, and the slurry mixing unit according to signals output from ozone density sensors(12,14,16), and keeps the density of ozone uniformly.
申请公布号 KR20030010069(A) 申请公布日期 2003.02.05
申请号 KR20010044834 申请日期 2001.07.25
申请人 CHOI, SUNG PIL 发明人 CHOI, SUNG PIL
分类号 B24B29/00;(IPC1-7):B24B29/00 主分类号 B24B29/00
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