| 摘要 |
<p>An object of the present invention relates to a soluble polyimide having an excellent heat resistance and low water absorption, a composition containing the soluble polyimide, which is cured at a relatively low temperature and has excellent heat resistance and adhesive properties, a bonding sheet using the composition, and adhesive laminated film for covering an accelerator beam tube and for covering a conductor wire for an accelerator quench heater, which have excellent workability, flexibility, and radiation resistance at a low temperature and especially have excellent adhesive properties. The polyimide is obtained by reacting an acid dianhydride represented by the general formula (1) <CHEM> (wherein X represents a bivalent organic group having -(CH2)k- or an aromatic group and k is an integer of 1 to 10) with a compound represented by the general formula (2) <CHEM> (wherein A represents -NH2- or -NCO, Y independently represents -C(=O)-, -SO2-, -O-, -S-, -(CH2)m-, -NHCO-, -C(CH3)2-, -C(CF3)2-, -C(=O)O- or a single bond, and m and n each are an integer of 0 to 10). The polyimide has a solubility of 10% or higher at 20 DEG C even in a low-boiling organic solvent, and has a glass transition temperature of 100 DEG C to 250 DEG C and water absorption of 1.5% or lower. Specially, by mixing with epoxy resin, the soluble polyimide is used as a composition, solution of polyimide adhesive, laminator, bonding sheet, and adhesive laminated films suitable for covering an accelerator beam tube or for covering a conductor wire for an accelerator quench heater.</p> |
