发明名称 |
Method for polishing workpieces and apparatus therefor |
摘要 |
<p>A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work surface is pressed against an abrading surface of a first polishing tool which is being rotated. In the second step, the work surface is pressed against a rubbing surface of a second polishing tool which is being moved in a planar translation motion relatively to the work surface.</p> |
申请公布号 |
EP1281476(A2) |
申请公布日期 |
2003.02.05 |
申请号 |
EP20020018968 |
申请日期 |
1997.05.16 |
申请人 |
EBARA CORPORATION |
发明人 |
NOBURU, SHIMIZU;NORIO, KIMURA |
分类号 |
B24B27/00;B24B37/04;B24B37/07;B24B37/10;B24B37/11;(IPC1-7):B24B37/04 |
主分类号 |
B24B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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