发明名称 |
A combined adhesion promotion and direct metallization process |
摘要 |
<p>A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.</p> |
申请公布号 |
EP1281792(A2) |
申请公布日期 |
2003.02.05 |
申请号 |
EP20020255413 |
申请日期 |
2002.08.01 |
申请人 |
SHIPLEY CO. L.L.C. |
发明人 |
BEGUM, ZATOON;GOOSEY, MARTIN T.;GRAVES, JOHN E.;POOLE, MARK A.;SINGH, AMRIK |
分类号 |
C25D5/54;C25D5/56;H05K3/18;(IPC1-7):C25D5/56 |
主分类号 |
C25D5/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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