METAL CHEMICAL MECHANICAL POLISHING PROCESS FOR MINIMIZING DISHING DURING SEMICONDUCTOR WAFER FABRICATION,申请号EP20010937301-传众专利搜索

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发明名称	METAL CHEMICAL MECHANICAL POLISHING PROCESS FOR MINIMIZING DISHING DURING SEMICONDUCTOR WAFER FABRICATION
摘要
申请公布号	EP1281199(A2)	申请公布日期	2003.02.05
申请号	EP20010937301	申请日期	2001.05.10
申请人	INFINEON TECHNOLOGIES NORTH AMERICA CORP.	发明人	LIN, CHENTING;PLOESSL, ROBERT
分类号	B24B;B24B7/24;B24B37/04;H01L21/302;H01L21/304;H01L21/321;H01L21/461;H01L21/768;(IPC1-7):H01L21/321	主分类号	B24B
代理机构		代理人
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