| 摘要 |
PURPOSE: To provide a substrate for packaging electronic components and a method for manufacturing the same, capable of securing full wire bonding strength, even if gold plated layer made as thin possible. CONSTITUTION: The substrate for packaging the electronic component comprises an insulation substrate 11, a wiring pattern 12 formed on one side of the insulation substrate 11, a solder resist layer 16 for covering the surface except for a terminal section of the wiring pattern 12 with a nickel plated layer 22 and the gold plated layer 23 laminated on the surface of the terminal section. The nickel plated layer 22 is to be 3μm or larger in thickness and larger than 350 in Vickers hardness.
|
