VERTICAL TYPE ELECTROPLATING APPARATUS USING INSOLUBLE ANODES

摘要

PURPOSE: A vertical type electroplating apparatus using insoluble anodes is provided to increase plating capacity per unit time and obtain products of high surface quality by increasing flow rate of a plating solution in a space between a metal strip to be plated and the anodes, thereby forming high current density. CONSTITUTION: In a vertical type electroplating apparatus using the insoluble anodes comprising a plating cell(1), conductor rolls(2), a pair or more of insoluble anodes(4), and a dipping roll(3), the vertical type electroplating apparatus further comprises plating solution pools(10) which are installed in the upper side of the insoluble anodes and have a shape in which the pool is gradually expanded as it goes from the lower side to the upper side, and into which the plating solution is consistently supplied; plating solution injection heads which are positioned at the upper part of the plating solution pools to spray thus supply the plating solution into the plating solution pools and equipped with solution jets having a width larger than a channel width between the metal strip (S) and the anodes; and a flow rate compensation means for preventing relative reduction of spraying width of the plating solution generated as flow rate of the plating solution is gradually increased as it goes from the upper side to the lower side of the plating cell, wherein the plating solution is flown down at a steady flow rate ranging from about 2.0 to 8.0 m/s along fine channels(5) between the metal strip (S) and the anodes.