| 摘要 |
PURPOSE: A laser repair key of a semiconductor chip is provided to be capable of accurately deciding PGC(Position Geometric Correction) by using the third feature. CONSTITUTION: A laser repair key is provided with an X-axis feature(1), an Y-axis feature(2) connected to the X-axis feature, and the third feature(3) formed between the X-axis feature and the Y-axis feature. At this time, the angle between the X-axis and Y-axis feature is 90 degree, and the angle between the X-axis feature and the third feature is 45 degree. Preferably, the third feature can be prolonged from the connecting portion between the X-axis and Y-axis feature to the inner portion. Preferably, the third feature is capable of being separated from the X-axis and Y-axis feature.
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