PCB FOR MOUNTING HIGH-PERFORMANCE SEMICONDUCTOR AND METHOD FOR FORMING CIRCUIT THEREOF

摘要

PURPOSE: A PCB(Printed Circuit Board) for mounting a high-performance semiconductor and a method for forming a circuit thereof are provided to reduce environmental pollution by forming a sidewall circuit portion without using Sn/Pb. CONSTITUTION: A CCL substrate has both sides formed with copper foils. A slim type internal slot is formed along an outline of an internal hole region to mount a semiconductor of the CCL substrate. The slim type internal slot is formed by using a router. The width of the slim type internal slot is 0.8 to 2.0mm. A copper plating process is performed on an entire surface of the CCL substrate. A power circuit portion(30) and a sidewall circuit portion(20) are formed by performing an exposure process, a development process, and an etch process. An internal hole(10) for mounting the semiconductor is formed by using a drill.