发明名称 |
METHOD FOR FABRICATING FLASH MEMORY DEVICE USING SELF-ALIGNED NON-EXPOSURE PATTERN FORMATION PROCESS |
摘要 |
PURPOSE: A method for fabricating a flash memory device using a self-aligned non-exposure pattern formation process is provided to form a hard mask for defining a control gate pattern on a cell region without an exposure process by using a lower stepped portion formed with a floating gate and an inter-gate dielectric. CONSTITUTION: A conductive layer, a blocking layer, and a photoresist layer are formed on a substrate including a floating gate pattern and an inter-gate dielectric pattern(100). A photoresist pattern is formed by developing the photoresist layer(110). A blocking layer pattern is formed by removing the exposed blocking layer(120). The photoresist pattern is removed(130). A hard mask is formed by oxidizing a surface of the exposed conductive layer(140,150). The blocking layer pattern is removed(160). A control gate is formed by etching the conductive layer. A stack gate is formed by removing the hard mask(170).
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申请公布号 |
KR20030010323(A) |
申请公布日期 |
2003.02.05 |
申请号 |
KR20010045223 |
申请日期 |
2001.07.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, DAE YEOP;LEE, JAE HAN |
分类号 |
H01L27/10;H01L21/28;H01L21/336;H01L21/8242;H01L21/8247;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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