发明名称 |
Connecting structure and frequency adjusting method therein |
摘要 |
A connecting structure for high frequency circuits is provided, with which components can be readily replaced, and which does not require high assembly accuracy and is applicable in a broad band. First and second circuit boards each having strip lines on top surfaces thereof are placed to secure a gap therebetween. Patch portions each constituting a resonator are formed by extending the width of the strip lines, and a supporting member of a foam material is placed on the top of the patch portion formed on the first circuit board. A parasitic element made of a dielectric material is cantilevered by the supporting member. The free end side of the parasitic element is placed above the patch portion formed on the second circuit board while securing a predetermined space between the parasitic element and this patch portion. A strong electrical connection is established by the parasitic element that electromagnetically couples non-continuing portions, thereby making it possible to cut a direct current.
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申请公布号 |
US6515561(B2) |
申请公布日期 |
2003.02.04 |
申请号 |
US20010773612 |
申请日期 |
2001.02.02 |
申请人 |
FDK CORPORATION;ARAI HIROYUKI |
发明人 |
TAMURA TAKASHI;ATSUMI NAOKI;ARAI HIROYUKI;IZUMI HAJIME |
分类号 |
H05K1/14;H01P1/04;H01P3/08;H01P5/02;H05K1/02;(IPC1-7):H01P1/04 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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