发明名称 |
Micro-BGA beam lead connection with cantilevered beam leads |
摘要 |
A tape automated bonding (TAB) tape is provided with an insulating tape having a die receiving section. The TAB tape also has a conductive wiring pattern forming a plurality of traces including a land at one end and a beam lead at another end. A tape window is formed in a portion of the tape die receiving section. At least one trace beam lead extends over the tape window from a first direction and is connected to a tie bar adjacent an opposing side of the tape window and at least one trace beam lead extends over the tape window from a second direction different than the first direction and is cantilevered over the tape window.
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申请公布号 |
US6515354(B1) |
申请公布日期 |
2003.02.04 |
申请号 |
US20000643848 |
申请日期 |
2000.08.23 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
FONTECHA EDWIN R.;VALLURI VISWANATH;VIVARES VALERIE |
分类号 |
H01L23/498;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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