发明名称 Micro-BGA beam lead connection with cantilevered beam leads
摘要 A tape automated bonding (TAB) tape is provided with an insulating tape having a die receiving section. The TAB tape also has a conductive wiring pattern forming a plurality of traces including a land at one end and a beam lead at another end. A tape window is formed in a portion of the tape die receiving section. At least one trace beam lead extends over the tape window from a first direction and is connected to a tie bar adjacent an opposing side of the tape window and at least one trace beam lead extends over the tape window from a second direction different than the first direction and is cantilevered over the tape window.
申请公布号 US6515354(B1) 申请公布日期 2003.02.04
申请号 US20000643848 申请日期 2000.08.23
申请人 ADVANCED MICRO DEVICES, INC. 发明人 FONTECHA EDWIN R.;VALLURI VISWANATH;VIVARES VALERIE
分类号 H01L23/498;(IPC1-7):H01L23/495 主分类号 H01L23/498
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