发明名称 |
LASER BEAM MACHINING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining method allowing cutting of a machining object without any fusion or a crack deviated from the planned cutting line on its surface. SOLUTION: The laser beam machining method is characterized by that it comprises a process of fixing a machining object 1 to a cohesive surface of a sheet (film), a process of radiating laser beam L into the machining object 1 by focusing a focal point P inside it to form a cutting planned line by using a modified area within the machining object 1 along the cutting planned line 5 of the machining object 1, and a process of cutting the machining object 1 along the planned line cutting line as it is still fixed to the sheet.</p> |
申请公布号 |
JP2003033889(A) |
申请公布日期 |
2003.02.04 |
申请号 |
JP20020093124 |
申请日期 |
2002.03.28 |
申请人 |
HAMAMATSU PHOTONICS KK |
发明人 |
FUKUYO FUMITSUGU;FUKUMITSU KENJI;UCHIYAMA NAOKI;WAKUTA TOSHIMITSU |
分类号 |
B28D5/00;B23K26/00;B23K26/04;B23K26/10;B23K26/40;B23K101/40;C03B33/09;H01L21/301;(IPC1-7):B23K26/00 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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