Composition of epoxy resin and triazine-formaldehyde-phenol resin

摘要

An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing:(A) an epoxy resin and(B) a phenol resinrepresented by the following general formula (1):wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.