发明名称 |
Apparatus and method for purging injection molding system |
摘要 |
An injection molding apparatus, system and method are provided in which the rate of material flow during the injection cycle is controlled. According to one preferred embodiment, a method of open-mold purging is provided in an injection molding system including a manifold to receive material injected from an injection molding machine. The method includes the steps of selecting a target purge pressure; injecting material from the injection molding machine into the manifold; and controlling the purge pressure to substantially track the target purge pressure, wherein the purge pressure is controllable independently from the injection molding machine pressure.
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申请公布号 |
US6514440(B1) |
申请公布日期 |
2003.02.04 |
申请号 |
US20000656846 |
申请日期 |
2000.09.07 |
申请人 |
SYNVENTIVE MOLDING SOLUTIONS |
发明人 |
KAZMER DAVID O;MOSS MARK D;BASSETT BRIAN;DOYLE MARK J |
分类号 |
B29C45/27;B29C45/28;B29C45/30;B29C45/76;B29C45/77;(IPC1-7):B29C45/24 |
主分类号 |
B29C45/27 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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