发明名称 Apparatus and method for purging injection molding system
摘要 An injection molding apparatus, system and method are provided in which the rate of material flow during the injection cycle is controlled. According to one preferred embodiment, a method of open-mold purging is provided in an injection molding system including a manifold to receive material injected from an injection molding machine. The method includes the steps of selecting a target purge pressure; injecting material from the injection molding machine into the manifold; and controlling the purge pressure to substantially track the target purge pressure, wherein the purge pressure is controllable independently from the injection molding machine pressure.
申请公布号 US6514440(B1) 申请公布日期 2003.02.04
申请号 US20000656846 申请日期 2000.09.07
申请人 SYNVENTIVE MOLDING SOLUTIONS 发明人 KAZMER DAVID O;MOSS MARK D;BASSETT BRIAN;DOYLE MARK J
分类号 B29C45/27;B29C45/28;B29C45/30;B29C45/76;B29C45/77;(IPC1-7):B29C45/24 主分类号 B29C45/27
代理机构 代理人
主权项
地址