| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting method of an IC chip improving the attaching position and attaching accuracy of an IC to an object, and a package material and a package container on which the IC chip is mounted manufactured by using the mounting method. SOLUTION: In the mounting method of the IC chip capable of read or read and write of data without contacting, a non-contact type IC chip (11) charged by positive or negative charges is drawn to an insulator roll (12) charged by the opposite charges, the insulator roll (12) is rolled on the object (13) on which the IC chip is desired to be mounted and the IC chip is mounted on the object. |
