| 摘要 |
PROBLEM TO BE SOLVED: To save consumption of processing liquid when supplying the processing liquid such as developing liquid through horizontal scanning the supply nozzle against almost a circular substrate. SOLUTION: The supply nozzle 4 has ejection holes 50 along almost the same length as the diameter of a wafer W or the like, wherein the inside of the nozzle 4 is divided into three channels 51 to 53 in the longitudinal direction. A first ejection region Wa is formed by the flow channel 51, a second ejection region Wb is formed by the flow channels 51, 52, and a third ejection region Wc is formed by the flow channels 51 to 53. Each flow channel is connected to a respective supply channel 54 having a pressure-setting valve, and each supply channel 54 is connected to a common processing-liquid tank 55 via a common pump P1. The pressure of the pump P1 is controlled so that, for example, if the pressure exceeds 0.03 Mpa, the valve Va is opened to eject the developing liquid from the first flow channel 51. An ejection region of the nozzle 4 is selected in accordance with the region to be coated of the wafer W, and consequently the ejection to regions outside the wafer W is reduced to save the processing liquid.
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