| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a small and simple structure of a reflow soldering apparatus, which effectively heats a circuit board to be soldered to mount semiconductor elements, etc., at a high accuracy. SOLUTION: The apparatus comprises a means 26 for transporting a circuit board 1 to be soldered, heating means 29, 30 located above and below or at least either above or below the transporting means 26 in the furnace, a means 35 for feeding a hot gas, forming a forced convection of heated air and a means 36 for exhausting the hot gas. The transport means 26 pierces a furnace 12 and locates therein. The board 2 has provisionally holds mounting components 3 with solder 4. The gas feeding means 35 and the exhausting means 36 are disposed with the transport means 26 held therebetween and located at side portions parallel to the board transporting direction.</p> |
