SEMICONDUCTOR PACKAGE, PRODUCTION METHOD THEREFOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To produce a core substrate without through hole working using a mechanical drill or the like in a semiconductor package, to provide high- density fine wiring formation as a result and to contribute to the reduction of production costs. SOLUTION: In a process for producing the core substrate of the semiconductor package by using a metal core, a through hole 40 is formed on the required spot of a metal core 21 by etching or punching, a resin film 22 is formed by coating the surface of the metal core 21 with an insulating resin by electro- coating while including the inner wall of the through hole 40, a conductor membrane 60 is formed over all the surface of the resin film 22, and the inside of the through hole 40 is filled with a conductor 23.