发明名称 ELECTRODE LAND ON PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide an electrode land on a printed board, which prevents the positional deviation or inclination of circuit components mounted on the printed board to provide a good yield, without deteriorating vibration resistance. SOLUTION: A circuit component 3, mounted on a printed board 1, has electrodes 4 which are to be soldered to electrode lands 2. Recesses 2a are formed into the electrode lands 2, so that the width size of a part of the electrode land 2 exceeds the width size of the electrode slightly 4.
申请公布号 JP2003031935(A) 申请公布日期 2003.01.31
申请号 JP20010217711 申请日期 2001.07.18
申请人 YASKAWA ELECTRIC CORP 发明人 WATANABE ATSUFUMI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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