| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve a problem where the production method of high mass- productivity is not established when a circuit device is made compact and thin in the circuit device packaged with a circuit element with a ceramic wafer or flexible sheet as a supporting substrate. SOLUTION: In the process of rear side resist coating, the position of an alignment mark 101 exposed on the rear side of conductive foil 60 is recognized so that the position of a conductive pattern 51 on the rear side is indirectly recognized for each block or for each of conductive foil. Then, a resist layer 90 is formed on the conductive pattern 51 while remaining an opening part 92 for forming a scheduled rear side electrode 91. Therefore, the production method for circuit device can be provided while shortening time.</p> |
