METHOD FOR PREPARING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for preparing a semiconductor device including a non-contact checking process capable of confirming whether a circuit and a circuit element formed on a TFT board capable of preventing drop up production yield operate normally or not by reducing defects due to sticking of fine dust in the checking process for the mass production of the semiconductor device. SOLUTION: By rectifying and shape forming the electromotive force generated by electromagnetic induction by using a primary coil on a check board and a secondary coil on an array substrate, power voltage and a driving signal are supplied to the circuit on the TFT board and the circuit element for driving them.