| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate cooler which can cool a substrate in a short time. SOLUTION: A baked substrate W carried into a substrate cooler 1 is placed at a mounting position P1 and cooled by means of a mounting plate 10. When the substrate W being cooled is placed at the mounting position P1, temperature of the mounting plate 10 is kept lower than a target cooling temperature thereof by a Peltier element 20. When the temperature of the mounting plate 10 reaches the target temperature, a lifter 30 is lifted and the substrate W is moved from the mounting position P1 to a separated position P2 and separated from the mounting plate 10 before cooling is stopped. Since the temperature of the mounting plate 10 is kept lower than the target temperature, and the baked substrate W is cooled quickly at the mounting position P1 and then moved to the separated position P2 so that the substrate W is not overcooled when the temperature of the substrate W is reached the target, the substrate can be cooled in a short time.</p> |
