| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliability and high-density multilayered board, its manufacturing method and an bonding structure. SOLUTION: The multilayer board, formed by mutually adhering wiring boards, is composed of a first wiring board 7, a second wiring board 3, a conductive material 5 for electrically connecting the first board 7 with the second board 3, and bonding structures 1, 2 for bonding the wiring boards each other. The adhering structure 1, 2 is composed of a porous layer 1 and adhesive layers 2 provided on both surfaces of the porous layer for adhering to the wiring boards. |
