发明名称 THIN FILM SEMICONDUCTOR DEVICE AND ITS SUBSTRATE, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thin film semiconductor device wherein a unit circuit having a gate electrode, a source electrode and a drain electrode is formed and arranged in order for every semiconductor single crystal grain formed in a semiconductor thin film, and can operate with high mobility without detrimentally affected by electron scattering or the like in grain boundary during operation, and its substrate and a manufacturing method thereof. SOLUTION: A substrate of a thin film semiconductor device has a semiconductor thin film layer wherein single crystal grain of a large diameter is aligned and arranged regularly by carrying out energy line irradiation in distributed form of energy line strength wherein a maximum value and a minimum value of irradiation energy line are aligned and arranged regularly for each irradiation region in a non-crystalline semiconductor thin film on an insulation substrate layer. A unit electrode is formed by positioning for each single crystal grain of the semiconductor thin film layer by using the substrate. Consequently, a thin film semiconductor device wherein a unit circuit is formed and arranged in order for each single crystal grain can be obtained.
申请公布号 JP2003031497(A) 申请公布日期 2003.01.31
申请号 JP20010218370 申请日期 2001.07.18
申请人 ADVANCED LCD TECHNOLOGIES DEVELOPMENT CENTER CO LTD 发明人 MATSUMURA MASAKIYO;OANA YASUHISA;ABE HIROYUKI;YAMAMOTO YOSHITAKA;KOSEKI HIDEO;KETSUSAKO MITSUNORI
分类号 B65G49/07;H01L21/20;H01L21/336;H01L21/67;H01L21/673;H01L21/677;H01L21/77;H01L21/84;H01L29/786;(IPC1-7):H01L21/20 主分类号 B65G49/07
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