| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal pressure bonding device which enables (1) correct positioning of flexible electrode and (2) maintenance of parallelism between a thermal pressure connection head and receiving board. SOLUTION: This thermal pressure bonding device has the configuration that a main supporting surface 10 for attracting electrode body 19 of flexible electrode 2 and a sub-supporting surface 11 for attracting only a terminal portion 4 are provided. The sub-supporting surface 11 can be freely displaced between the horizontal position in the same surface level of the main supporting surface 10 and the drawing position isolated from the terminal 4. Each of the thermal pressure bonding tools of both terminals 3, 4 is respectively composed of a thermal pressure bonding head 5 which can be freely moved upward and downward and a pair of receiving boards 12. The thermal pressure bonding head 5 is coupled with a lifting mechanism 6 via two swinging axes 14, 15 and can freely be swung to the receiving board 12 in the two directions determined by the swinging axes 14, 15. Moreover, fixing means 28, 29 for holding to the lifting mechanism 6 the swinging attitude in the desired direction relative to the horizontal surface are provided on every swinging axis 14, 15.
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