| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board from becoming contaminated with a solvent of an adhesive and which win not be an impediment to a subsequent manufacturing processes. SOLUTION: The printed wiring board has a flexible insulating substrate and a printed wiring pattern and a stopper, which are formed on the flexible substrate, and at least one IC chip is bonded and connected to the printed wiring board. A die paste dam is formed between the bonding pad of the printed wiring pattern and the IC chip. Furthermore, the die paste dam is formed to smaller height than that of the stopper.
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