| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem caused by the formation of an interlayer insulating film and to reduce a noise current generated in a circuit (semiconductor element) by the light emission of a light emitting diode. SOLUTION: A second board with a wiring layer equipped with bumps located at the prescribed positions is superposed on a first board where a light emitting element and a drive circuit are arranged, and the bumps are connected to the electrodes of the light emitting element and furthermore the electrodes of the drive circuit. By this setup, the light emitting element and the drive circuit are connected to external electric signals without covering them with an insulating film. The light emitting element and the drive circuit are arranged so as to enable the light emitting plane of the light emitting element and the circuit- formed surface of the drive circuit to face in opposite directions respectively. |
