| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a conventional plasma etching apparatus having the possibility of dropping and adhering ionized particles which are not immediately discharged by only exhausting, the particles floating in a plasma-generating space on a material to be treated, having a residual charge, immediately after etching is finished. SOLUTION: The plasma etching apparatus 101 comprises a vacuum chamber 2, a holding electrode 3, an opposed electrode 4 arranged opposite to the electrode 3, a plasma-generating RF power source 5, a ring-like electrode 102 as a third electrode disposed, so as to surround a periphery of the space region, in which the electrode 3 and the electrode 4 face each other in the chamber 2, and a power source 103 for the third electrode connected to the electrode 102 to make electrode 102 charged.
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