| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device and a bonding method for realizing high speed switching of control modes in a bonding operation. SOLUTION: The bonding device is used for thermal pressure bonding of a chip to a substrate with a bonding tool while a load is applied to the chip. In this bonding device, a control system of Z-axis motor 6a to drive the bonding tool is composed of a controller 18 as a main controller, a sub-controller for exchanging signals, a memory 21 for storing program and data such as control variables, and a Z-axis motor driver 13 including a detecting function to detect position and velocity of bonding tool. At the time of controlling the Z-axis motor 6a with the sub-controller 20 via a current controller 26, the sub-controller 20 switches between a first control mode for control based on the program and data stored in the memory 21 and a second control mode for control based on the commands from the main controller 18.
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