| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated chip component which prevents connection failure of lead electrodes formed on a plane approximately perpendicular to the laminating direction and improves the flection strength and bending strength at mounting. SOLUTION: The laminated chip component 9 has lead electrodes for connecting laminated inner electrodes 13, 14 to outer electrodes. The lead electrodes 11, 12 are formed on two inner planes approximately perpendicular to the laminating direction and drawn onto outer planes approximately parallel to the laminating direction. Outside electrodes 11a, 11c, 12a, 12c of the lead electrodes 11, 12 drawn onto the outer planes 1-4 are formed with a narrow width and inner electrodes 11b, 11d, 12b, 12d on the inner planes are formed with a wide width at positions inward away from the outer planes 1-4.
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